The utility model claims a fan-out type package integrated magnetic induction device. the fan-out type package integrated magnetic induction device comprises: a substrate; one or more semiconductor chips the one or more semiconductor chips are embedded in the substrate; a conductive winding the conductive winding is embedded in the substrate and around the one or more semiconductor chips; one or more passivation layer the one or more passivation layer is covered on the conductive winding and the one or more passivation layer has one or more contact hole; and one or more rewiring layers the one or more rewiring layers are arranged at least above the passivation layer and the one or more rewiring layers are electrically connected with the conductive winding through one or more contact holes in the passivation layer. Using the technical solution of the utility model can make the magnetic induction device can effectively use the packaging space and has a very small resistance of the beneficial effect.

Countries or Regions:

CN

Invention Code:

IP.PA.01291

Contact Us:

okt@ust.hk