Techniques are provided for forming thin film transistors having a polycrystalline silicon active layer formed by metal-induced crystallization (MIC) of amorphous silicon in an oxidizing atmosphere. In an aspect a transistor device is provided that includes a source region and a drain region formed on a substrate and an active channel region formed on the substrate and electrically connecting the source region and the drain region. The active channel region is formed with a polycrystalline silicon layer having resulted from annealing an amorphous silicon layer formed on the substrate and having a metal layer formed thereon wherein the annealing of the amorphous silicon layer was at least partially performed in an oxidizing ambience thereby resulting in crystallization of the amorphous silicon layer to form the polycrystalline silicon layer.

Countries or Regions:

US

Invention Code:

IP.PA.00776

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