Implementing Self-Assembly Nanometer-Sized Structures Within Metal - Polymer Interface
An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces with the interlayer forming a bond to both surfaces.
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US
Invention Code:
IP.PA.00426
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okt@ust.hk
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Category:
TAP - Advanced Materials
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