Percolation Efficiency of the Conductivity of Electrically Conductive Adhesives
An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA) and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens pseudohalogens or their precursors.
Countries or Regions:
US
Invention Code:
IP.PA.00384
Contact Us:
okt@ust.hk
Authors:
Key Features:
Specification:
Category:
TAP - Advanced Materials
Reference:
Contact Us:
Download (0)
No file is available now.
You would be able to download the files marked with an asterisk '*' only after logging in to your account and completing the purchase of the product license.