Thermal Management System with Three-Dimensional Interconnected Porous Graphene-Based Thermal Interface Materials
A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.
Countries or Regions:
USA
Invention Code:
TTC.PA.643
Contact Us:
okt@ust.hk
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Category:
TAP - Energy and Sustainability
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