Design and Fabrication Processes of Silicon Submount with Cavities and Through Vias for LED Wafer Level Packaging and LED Packages Produced Thereof
A wafer having a plurality of light-emitting diode (LED) submounts and a method for fabricating an LED submount are provided. Each of the plurality of LED submounts of the wafer includes: a substrate (201), including through vias (203a); an LED die (208) mounted in a cavity (204) on a first side of the substrate (201) and connected to the through vias (203a); a redistribution layer (205a) attached to a second side of the substrate (201) connected to the LED die (208) through the through vias (203a). The method includes providing a wafer as a substrate (201); providing a cavity (204) in the substrate (201) on a first side of the substrate (201); providing through vias (203a) in the substrate (201), providing a redistribution layer (205a) on the second side of the substrate (201), and mounting an LED (208) in the cavity (204), wherein the LED die (208) is connected to the redistribution layer (205a) through the through vias (203a).
Countries or Regions:
China
Invention Code:
TTC.PA.545
Contact Us:
okt@ust.hk
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Category:
TAP - Microelectronics
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