Large Inductance Integrated Magnetic Induction Device

Methods and apparatus described herein are associated with integrated magnetic induction devices. A magnetic induction device can include a groove formed in a substrate, a magnetic core included in the groove and surrounded by a conductive winding that is adjacent to portion(s) of the substrate, and respective insulation layers included between the substrate and the conductive winding and between the magnetic core and the conductive winding. An inductor can further include conductive vias formed in the substrate and connected to respective portions of the conductive winding. Further, a transformer can include a groove formed in a substrate, a closed-loop/gapped magnetic core included in the groove and surrounded by first and second conductive windings that are adjacent to respective portions of the substrate, and respective insulation layers formed between the substrate and the first and second conductive windings, and between the closed-loop/gapped magnetic core and the first and second conductive windings.

 

Countries or Regions:

USA, China

 

Invention Code:

TTC.PA.527

 

Contact Us:

okt@ust.hk


Authors:
Key Features:
Specification:
Category:
TAP - Microelectronics
Reference:
Contact Us:
Download (0)

No file is available now.
You would be able to download the files marked with an asterisk '*' only after logging in to your account and completing the purchase of the product license.
License
Price Per Unit:
(Not Applicable)
Terms: (Not Applicable)
License Type: