A Method of Improving the Percolation Efficiency of the Conductivity of Electrically Conductive Adhesives
An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.
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USA
Invention Code:
TTC.PA.384
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okt@ust.hk
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TAP - Energy and Sustainability
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